The Need for Faster Time to Market in the Semiconductor Domain

A semiconductor manufacturer was experiencing high defect rates and production delays during the assembly of a new vacuum chamber used in wafer fabrication. Common issues included misalignment of components, excessive rework due to improper fastener placement, and frequent contamination in the cleanroom. These problems were traced back to design errors that were not identified during the CAD phase, leading to increased costs and production inefficiencies.

• Challenges

  1. Misaligned Components: Critical parts such as wafer handlers and robotic arms were frequently misaligned, leading to operational disruptions and damage.
  2. Excessive Fasteners: Duplicate hardware in the assembly design created confusion, leading to assembly errors and increased time to fix during production.
  3. Sealing Failures: Improper placement of gaskets and seals resulted in vacuum leaks, compromising the chamber’s ability to maintain high vacuum levels.
  4. Contamination Issues: Particle generation due to misassembled or excess components led to contamination inside the vacuum chamber, affecting wafer quality.
  5. Tight Tolerances Not Met: Key mechanical tolerances were often missed, causing cumulative errors that led to poor fit and finish.

• DFMPro Implementation

  • The company integrated DFMPro tools early in the design cycle to analyze critical areas of the chip for manufacturability challenges.
  • Automated DFMPro checks were implemented to flag violations related to lithography, etching, and chemical-mechanical polishing (CMP).
  • The design team worked closely with the manufacturing team to optimize the chip layout, focusing on increasing process margins for critical features.

• Outcome

  After implementing DFM:

  • Reduction in Assembly Review Time: Streamlined design led to faster assembly processes, reducing rework and confusion on the production floor.
  • Reduction in Defects: Improved design quality reduced the number of defective products, especially in vacuum seal performance and component alignment.
  • Increased Yield: The optimization of assembly processes led to improved product yields, as fewer wafers were compromised by contamination or misalignment.
  • Time to market was shortened as fewer design iterations were needed to meet manufacturability requirements.
  • The company was able to scale production to meet the growing demand for their chips, gaining a competitive advantage.